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Product Short Description
A low temperature tin is used to re-install the ic low temperature and iPhone X, which melts at a low temperature so as not to affect the board and components during assembly. It is characterized by melting at a temperature of 158 degrees
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A low temperature tin is used to re-install the ic low temperature and iPhone X, which melts at a low temperature so as not to affect the board and components during assembly. It is characterized by melting at a temperature of 158 degrees - from G-lon